Method for bonding a conductive wire to a metal electrode

作者: Yuzaburo Sakamoto , Morio Toyooka

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摘要: A connector wire is bonded to a solder electrode by pressing the end portion thereof using capillary while heated up temperature not less than melting point of solder, and then cooling whole bonding area electrode, thereby buried in firmly fixed thereto.

参考文章(5)
Hans E Patzer, Ronald C Grable, Wire bonding apparatus for microelectronic components ,(1966)
Joseph S Manowczak, Michael K Avedissian, Sequential wire and articlebonding methods ,(1966)
Richard L Goldman, William R Kritzler, Victor C Sirvydas, Fabrication of semiconductor device ,(1966)