Bond connection for components
作者： Marc K. Chason , Michael J. Onystok , Nathan P. Bellin
DOI:
关键词: Composite material 、 Spheroid 、 Materials science 、 Lead (electronics) 、 Connection (principal bundle) 、 Soldering 、 Joint (geology) 、 Surface tension 、 Solder mask 、 Planarity testing
摘要: An electrical joint using spheroidal tipped leads improves the strength of a connection regardless material used to bond connections. Axial component are formed into spheroids an appropriate heat source melt small portion lead tip. Melting alloys with any non-wettable solder mask rendering wettable spheroid. Surface tension in molten metal forms The spheroid increases area which or other bonding agent adheres to. Solder remaining on decreases wicking further up lead. Reduced retains compliance Controlled melting maintains planarity for multileaded components.
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