Dielectric composition for forming dielectric layer for use in circuitized substrates
作者： Kostas Papathomas , Robert Japp
DOI:
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摘要: A dielectric composition which forms a layer usable in circuitized substrates such as PCBs, chip carriers and the like. As layer, it includes cured resin material predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or like part thereof.
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