Process for using a composition for a solder mask
作者： Thomas S. Thoman , George A. Salensky
DOI:
关键词:
摘要: This invention relates to a solder mask composition for thermoplastic substrates. The has critical components which include polyhydroxyether and melamine formaldehyde. Other solvent, filler flow control agent. Optional ingredients colorant, epoxy resin acid promote the reaction of composition. A surfactant can also be included. provides necessary flexibility adhesion required circuit boards. applied directly board or transfer medium subsequent covering substrate. It an article board. process making such composites includes processing mask.
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