Thin-Film Device and Method of Fabricating The Same
作者： Ethem Erkan Aktakka , Hanseup Kim , Khalil Najafi
DOI:
关键词:
摘要: A thin-film device and a method of fabricating the are provided herein. The comprises bond layer, film layer that has bulk material properties, substrate heat-sensitive component disposed thereon. step providing an active properties. is bonded to through layer. After bonding substrate, thinned produce device. with thereon prior substrate.
google.de 参考文章(34)
Jeffrey Birkmeyer, Zhenfang Chen, Andreas Bibl, Polishing Piezoelectric Material ,(2007)
David J. Mountain, Method of thinning semiconductor wafer of smaller diameter than thinning equipment was designed for ,(1998)
Chij-Chang Chen, Chun-Fa Lan, Hung-Yin Tsai, Chia-Jen Ting, Shih-Shian Ho, Method for manufacturing bonded wafer with ultra-thin single crystal ferroelectric film ,(2004)
Larry G. Waterfield, Glen F. Forck, Piezoelectric actuator device ,(2000)
Alan Jankowski, Mariam Maghribi, Jeffrey D. Morse, Julie Hamilton, Klint A Rose, Peter Krulevitch, Robert T. Graff, William Benett, Microfluidic fuel cell systems with embedded materials and structures and method thereof ,(2002)
Akira Hamajima, Kengo Suzuki, Yuichi Iwata, Takashi Yoshino, Shoichiro Yamaguchi, Piezoelectric thin-film device ,(2007)
Scott A. Elrod, William S. Wong, Baomin Xu, Michael C. Welsberg, Karl A. Littau, John S. Fitch, Steven A. Buhler, Scott E. Solberg, Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure ,(2006)
Wen H. Ko, Qiang Wang, Method of fabricating silicon capacitive sensor ,(1999)
Timothy David Sands, William S. Wong, Nathan W. Cheung, Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials ,(2001)
Karl A. Littau, Meng H. Lean, John S. Fitch, Steven A. Buhler, Method of fabricating an array of multi-electroded piezoelectric transducers for piezoelectric diaphragm structures ,(2005)