Semiconductor layered device with data bus
作者： Chiaki Dono , Chikara Kondo
DOI:
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摘要: Apparatuses and methods of data communication between semiconductor chips are described. An example apparatus includes: a first chip second that stacked with each other via through substrate vias (TSVs) provided in one the chip. The communicate by use bus inversion have been encoded using DBI algorithm.
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