A high end routing platform for core and edge applications based on chip to chip optical interconnect

作者: Kobi Hasharoni , Shuki Benjamin , Amir Geron , Gideon Katz , Stanislav Stepanov

DOI: 10.1364/OFC.2013.OTU3H.2

关键词:

摘要: A telecom router utilizing a parallel optical interconnect is described with the highest reported aggregate bandwidth 1.34Tb/s, and density 64Gb/s/mm2. The device based on direct assembly of large optoelectronic III-V chips CMOS.

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