336-Channel electro-optical interconnect: Underfill process improvement, fiber bundle and reliability results

摘要: The icPhotonics™ optical module assembly development was presented in [1]. allows for aggregate full duplex data rate of better than 1.30 Tb/s with Bit Error Rate (BER) <; 1E-12 into and out a single ASIC die distances up to 300m. uses standard semiconductor processing equipment materials. components - an organic interposer (substrate), (standard TSMC 65nm node technology), two 168-channel 1000nm dies (VCSELs photodiodes) Micro Lens Arrays (MLA's) 168 pixels each are all assembled using flip-chip technology, allowing very high density transfer. 1.344 transfer is enabled from the VCSELs PD's through sets multi-mode fiber bundles. fiber-bundle's design special production sequence enable efficiency low-loss MT-Ferrule connector. Several modules can thus be connected allow applications which require BW transferred between different dies, bandwidth 64Gb/s/mm 2 . A major challenge associated unusual underfill application 2 center hole substrate. overall yield Optical Interconnect (OI) enhanced MW-plasma treatment before applying underfill. In this paper general failure modes process examined comparison without plasma activation presented. Various reliability tests were performed on module, its accompanied fiber-bundle assembly. entire exposed thermal cycles rapid aging procedures, testing soldering performance. components, especially VCSELs, also prolonged procedures while their performances. Reliability results presented, as well additional large format fiber-bundle, BER changes after exposure environmental conditions.