Verfahren zur Herstellung einer thermoelektrischen Dickschichtvorrichtung

Kyung Tae Kim, Gook Hyun Ha, Fabrication and characterization of thermoelectric thick film prepared from p-type bismuth telluride nanopowders. Journal of Nanoscience and Nanotechnology. ,vol. 12, pp. 1577- 1580 ,(2012) , 10.1166/JNN.2012.4681

C. Navone, M. Soulier, J. Testard, J. Simon, T. Caroff, Optimization and Fabrication of a Thick Printed Thermoelectric Device Journal of Electronic Materials. ,vol. 40, pp. 789- 793 ,(2011) , 10.1007/S11664-011-1572-6

Ju Hyung We, Sun Jin Kim, Gyung Soo Kim, Byung Jin Cho, Improvement of thermoelectric properties of screen-printed Bi2Te3 thick film by optimization of the annealing process Journal of Alloys and Compounds. ,vol. 552, pp. 107- 110 ,(2013) , 10.1016/J.JALLCOM.2012.10.085

Heon Bok Lee, Ju Hyung We, Hyun Jeong Yang, Kukjoo Kim, Kyung Cheol Choi, Byung Jin Cho, Thermoelectric properties of screen-printed ZnSb film Thin Solid Films. ,vol. 519, pp. 5441- 5443 ,(2011) , 10.1016/J.TSF.2011.03.031

Ju Hyung We, Heon Bok Lee, Sun Jin Gim, Gyung Soo Kim, Kukjoo Kim, Kyung Cheol Choi, Onejae Sul, Byung Jin Cho, Development of a Measurement Method for the Thermal Conductivity of a Thick Film Prepared by a Screen-Printing Technique Journal of Electronic Materials. ,vol. 41, pp. 1170- 1176 ,(2012) , 10.1007/S11664-011-1857-9

B. Walton, Principles of thick film materials formulation Radio and Electronic Engineer. ,vol. 45, pp. 139- 143 ,(1975) , 10.1049/REE.1975.0024

Fei Li, Xiangyang Huang, Wan Jiang, Lidong Chen, Interface Microstructure and Performance of Sb Contacts in Bismuth Telluride-Based Thermoelectric Elements Journal of Electronic Materials. ,vol. 42, pp. 1219- 1224 ,(2013) , 10.1007/S11664-013-2566-3

Wen P. Lin, Daniel E. Wesolowski, Chin C. Lee, Barrier/bonding layers on bismuth telluride (Bi2Te3) for high temperature thermoelectric modules Journal of Materials Science: Materials in Electronics. ,vol. 22, pp. 1313- 1320 ,(2011) , 10.1007/S10854-011-0306-0

Chien-Neng Liao, Ching-Hua Lee, Wen-Jin Chen, Effect of Interfacial Compound Formation on Contact Resistivity of Soldered Junctions Between Bismuth Telluride-Based Thermoelements and Copper Electrochemical and Solid State Letters. ,vol. 10, pp. 23- ,(2007) , 10.1149/1.2749330

C. Navone, M. Soulier, M. Plissonnier, A. L. Seiler, Development of (Bi,Sb)2(Te,Se)3-Based Thermoelectric Modules by a Screen-Printing Process Journal of Electronic Materials. ,vol. 39, pp. 1755- 1759 ,(2010) , 10.1007/S11664-010-1187-3