Method for producing layered structures on a substrate, substrate and semiconductor components produced according to said method
作者： Rolf Brendel
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摘要: The invention relates to a method for producing layered structures, whereby preferably porous material layer with hollow cavities is produced on or from monocrystalline p-type n-type Si substrate. structure part thereof applied said and subsequently, the separated substrate using as desired break-off point, e.g. by mechanical tension inside boundary surface of layer. characterized in that structured before structured.
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