Single ald cycle thickness control in multi-station substrate deposition systems
作者： Adrien Lavoie , Romuald Nowak , Jun Qian , Hu Kang
DOI:
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摘要: Disclosed are methods of depositing films material on multiple semiconductor substrates in a multi-station processing chamber. The may include loading first set one or more into the chamber at process stations and film onto by performing N cycles deposition. Thereafter, further transferring from to second stations, sets N′ deposition, wherein is not equal N. Also disclosed apparatuses computer-readable media which be used perform similar operations.
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