作者: Nikhil Apte , Srikant Vaithilingam , Ali Fatih Sarioglu , Mario Kupnik , Butrus T. Khuri-Yakub
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摘要: Abstract – We present the design and fabrication of 1D capacitive micromachined ultrasonic transducer (CMUT) arrays optimized for imaging using multiple modalities. A new variation process based on a thick buried oxide layer is used to build these CMUTs. In our process, via connections each cell’s electrode with handle are made from front side. This enables fabricating CMUT cells smaller sizes, higher resonant frequencies. Initial characterization results agree well simulations. Keywords: CMUT, thick-BOX multi-modality imaging, MEMS I. I NTRODUCTION Capacitive Micromachined Ultrasound Transducers (CMUTs) offer many advantages over conventional piezoelectric transducers. CMUTs inherently have large bandwidth (in immersion). Unlike transducers, they do not overheat when delivering ultrasound energy prolonged period time. These qualities make ideal use in medical techniques like harmonic ultrafast