A Study on the Convective Heat Transfer in Micro Heat Exchanger Embedded in Stacked Multi-Chip Modules
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DOI: 10.3795/KSME-A.2004.28.6.774
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摘要: This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro exchangers to be used cooling power-intensive semiconductor packages, especially stacked multi-chip modules. In analysis, parametric study was carried out parameters affecting efficiency flow coolants parallel rectangular micro-channels. study, performance exchanger tested on prototypes modules with difference channel dimensions. The simulation results experiment data were acceptably accordant within wide range design variations, suggesting procedure as useful method designing mechanism packages similar electronic applications.
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