Multiobjective Design Optimization of IGBT Power Modules Considering Power Cycling and Thermal Cycling
作者： Bing Ji , Xueguan Song , Edward Sciberras , Wenping Cao , Yihua Hu
DOI: 10.1109/TPEL.2014.2365531
关键词:
摘要: … by the manufacturer (eg, 150 or 175 C for silicon devices) must … C1 is a curve fitting constant of 640, exponent constant C2 is … least degree of constrain violation is selected. Finally, if both …
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