作者: Paul-David Morrison
DOI:
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摘要: A fine-pitch hermetic device (10) can be manufactured wherein two sets of wire bonds (18 & 20) are used to electrically connect a semiconductor die (12) leadframe (16). Jumper leads or conductive pads (28) placed on an inner surface ceramic base (14) interconnect the bonds. The jumper enables shorter lengths used. is attached with glass embed technology. cap (22) affixed seal (24). invention also compatible flip-chip dice and multichip modules.