Polymeric mask protection for alternative KOH silicon wet etching
作者： G Canavese , S L Marasso , M Quaglio , M Cocuzza , C Ricciardi
DOI: 10.1088/0960-1317/17/7/022
关键词:
摘要: A new cost-effective setup for silicon bulk micromachining is presented which makes use of a polymeric protective coating, ProTEK® B2 instead conventional hardmask. Different concentrations KOH and bath conditions (pure, with surfactant, stirrer, both surfactant stirrer) have been considered. coating exhibits good adhesion to Si substrates, no degradation, etching rates surface roughness comparable literature data, times greater than 180 min without damaging front side microstructures. Microcantilevers also fabricated using two different process flows in order demonstrate the suitability such microelectromechanical system (MEMS) technology.
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