AUTOMATIC WIRING INSPECTION DEVICE

作者: Nakajima Masahito , Tsukahara Hiroyuki

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摘要: PURPOSE:To perform an automatic wire inspection by a method wherein the titled device is composed of recognition system with which bonding address recognized, image supply will be outputted, indicating circuit outputs both starting and ending points, output system. CONSTITUTION:IC packages 2 are fed to sample conveying mechanism 1 successively, leads bonded, video signal region obtained using TV camera 7, said supplied A/D conversion 12 through intermediary carmera controller 11. Then, digital memorized in memory 13, read out, it added interval detecting 14 connected starting-ending point 15. Subsequently, 16, control 9, illumination 8 X-Y stage 10 controlled. Thus, given whether wiring condition normal or not can discriminated.

参考文章(1)
Masahito Nakajima, Masato Miyamura, Tetsuo Hizuka, Yushi Inagaki, Inspection device for semiconductor bonding wire ,(1981)