Wire bonding inspecting apparatus with moving imaging area

摘要: A wire bonding inspecting apparatus for wires bonded between a semiconductor chip and leads comprises an imaging device optically taking image of the converting optical into electric signals; moving device; processing unit obtaining positional coordinates on basis signals coordinates; main controller. When whole does not lie within area device, moves takes plural images whenever moved converts signals, respectively; obtains relative are taken transforms absolute inspection, thus enabling long to be inspected without adjusting lens magnification, that is, under constant high resolution.