Method and apparatus for inspecting semiconductor devices for their bonding status
作者： Masamichi Shindo , Toshihiro Kato , Yoshihito Fukasawa
DOI:
关键词: Materials science 、 Beam (structure) 、 Optics 、 Reflection (physics) 、 Semiconductor device 、 Laser beams 、 Optoelectronics
摘要: An apparatus and a method for inspecting semiconductor devices, where focused laser beam scans the device, reflected thereof indicating height information of reflection positions on device is detected producing signals. The signals are compared with predetermined acceptance levels distance.
lens.org 参考文章(5)
Akikazu Tanimoto, Kiwao Nakazawa, Apparatus for measuring the line width of a pattern ,(1976)
Keiichi Tamura, Apparatus for inspecting configuration of terminal legs of an electronic device ,(1987)
RobertL Comstock, MichaelR Hansen, EdrickH Tong, 4736108 Apparatus and method for testing coplanarity of semiconductor components Microelectronics Reliability. ,vol. 29, pp. 288- ,(1989) , 10.1016/0026-2714(89)90586-6
Percy Manchand, Process for preparing 2,4-diamino-5-(substituted benzyl)-pyrimidines ,(1976)
W. Moir Ii Floyd, George Gugliotta, Edward M. Moros, Pin receptacle inspection apparatus and method ,(1979)