Wire bonding apparatus, record medium storing bonding control program, and bonding method
作者： Kuniyuki Takahashi , Shinji Maki , Noriko Suzuki , Noriko Mori , Shinsuke Tei
DOI:
关键词: Wire bonding 、 Materials science 、 Optoelectronics 、 Electronic engineering 、 Ball (bearing) 、 Detector
摘要: A wire bonding apparatus including a control section provided with an electrical non-bonding detector, optical and shape which are for detecting between first point wire; when is detected by the detector also then tip end of reformed by, based on ball formation device into prescribed shape, rebonding performed at point.
lens.org 参考文章(45)
Daniel J. Muldoon, James M. Weaver, Ehud Efrat, Wire bonder tail length monitor ,(1993)
Frederick M. Persson, David C. Frankel, Method and apparatus to detect automatic wire bonder failure ,(1978)
Larry D. Burkholder, William J. Gleeson, Bradley K. Benton, Owen E. Gibson, Bond signature analyzer ,(1989)
Krishna Seshan, David C. Long, Ultrasonic adhesion/dehesion monitoring apparatus with power feedback measuring means ,(1992)
Naoki Miyazaki, Kazuhiro Kawabata, Method and apparatus for forming balls at the ends of wires ,(1991)
Yoshimitsu Terakado, Kazumasa Sasakura, Method and apparatus for forming a ball at a bonding wire end ,(1992)
Kuniyuki Takahashi, Hijiri Hayashi, Bonding load correction method and wire bonding apparatus ,(1998)
Allan I. Dacanay, Enrique R. Ferrer, Raymond M. Partosa, Wire bond integrity test system ,(2004)
Peter Hess, Nicolino Onda, Markus Michler, Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder ,(2003)
Toru Mochida, Shinichi Nishiura, Wire bonding method and apparatus ,(1992)