Wire bonder tail length monitor

摘要: Apparatus for monitoring the length of a fine wire tail made after second bond interconnection includes continuity circuit and system (WBMS) in an automatic bonder. The Z axis position bonding tool is sensed to determined height on at time breaks from bond. determines if clamps are initiated when electronic flame-off control fired. Logic WBMS determine proper make ball not, what remedial measures must be avoid damage semiconductor device being bonded.