Detection method for wire bonding failures
作者： Tohru Mochida , Yoshimitsu Terakado , Nobuto Yamazaki
DOI:
关键词: Wire bonding 、 Structural engineering 、 Voltage 、 Composite material 、 Materials science
摘要: Method for detecting failures in wire bonding is performed by applying a minimal voltage to between the first and second steps, step cutting step, before next step. Thus, whether or not have been properly condition proper are all detected advancing bonding.
lens.org 参考文章(7)
Donald E. Cousens, John A. Kurtz, Mark D. Dufour, Lead-wire bond attempt detection ,(1984)
John D. Dreibelbis, I. Marvin Weilerstein, Wire bond monitoring system ,(1985)
Rand C. Sherman, Van E. Wood, On-line inspection method and system for bonds made to electronic components ,(1982)
K Spanjer, Method for control of welding apparatus ,(1973)
Ozaki Takayuki, WIRE CUT DETECTION IN SEMICONDUCTOR WIRE BONDING DEVICE ,(1980)
Satou Takeo, METHOD OF JUDGING CONNECTION OF BONDING WIRE ,(1980)
Sakai Kenji, METALLIC WIRE DISCONNECTION DETECTOR ,(1978)