Ball bonding method and apparatus for performing the method

作者: Farhad Farassat , Walter Birgel

DOI:

关键词: Structural engineeringClampBall (bearing)Wire bondingCapillary actionBall bondingComposite materialUltrasonic sensorWeldingMaterials scienceBreakage

摘要: A ball bonding method and apparatus is disclosed including gold wire bonding. The steps include positioning lowering a bond capillary (10) with (11) flame-scarfed (12) downwardly onto first pad (17). welded by heating applying pressure or ultrasonic, both. raised moved to form loop (21), followed the step of welding second (16) using pressure, ultrasonic tail-length position (29) broken vertical pulling force created closing clamp (13) raising engaging (11). end free (12). For flame-scarfing, distance travelled until breaks measured flame-scarfing lance (18) accurately adjusted, after breakage adjusted.

参考文章(6)
Frederick M. Persson, David C. Frankel, Method and apparatus to detect automatic wire bonder failure ,(1978)
Donald E. Cousens, John A. Kurtz, Mark D. Dufour, Lead-wire bond attempt detection ,(1984)
Richard F Foulke, James E Kelly, Tailless wire bonder ,(1972)
John D. Dreibelbis, I. Marvin Weilerstein, Wire bond monitoring system ,(1985)
Dan Vilenski, Albert Soffa, Lawrence Matthew Rubin, Glen Bradley Bilane, Processor-controlled drive apparatus for a semiconductor-wire bonder and method of operating same ,(1979)