A laminated semiconductor structure
作者： Tetsuo Machii , Takehiko Kobayashi , Takshiro Sawano , Tadao Dengo , Masanobu Suenaga
DOI:
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摘要: A semiconductor apparatus comprising a first and second electrode substrate arranged substantially in parallel to each other, element containing plurality of members located between opposite the substrates, layer organic adhesive material inserted substrates for their integral bonding, means connecting with aforesaid mechanically as well electrically.
lens.org 参考文章(7)
Shockley William, Method of making a semiconductive switching array ,(1958)
Earl L Wilkie, James W Crowe, Raymond M Craig, Heat sink assembly for semiconductor devices ,(1968)
Robert M Ryder, Edward I Doucette, Protected semiconductor device and method of making it ,(1959)
Reinig Harry, Luedicke Eduard, Modular structures and methods of making them ,(1961)
Albrecht Geppert, Richard Magner, Semiconductor rectifier unit ,(1966)
Kazuo Fujimoto, Method for manufacturing semiconductor devices ,(1967)