Heat-conductive composite material
作者： Kenji Hirano , Yasuyuki Nakamura , Makoto Kawakami
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摘要: A heat-conductive composite material usable as a substrate (heat sink) for mounting semiconductor thereon or lead frame includes which comprises core sheet and metal foil layers welded to the both surfaces of sheet. The is composed high thermal expansion sandwiched between two sheets low expansion, each having number through-holes in direction thickness, three are laminated integrated so that part exposed out through made same different from constituting Varying thickness ratio respective constitutional surface area spots on sheet, materials any desired coefficient conductivity can be obtained. Additionally, by providing outermost has an improved uniform heat-receiving effect excellent heat-diffusing effect. Further, free fine pores thereof therefore weldability.
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