Electronic circuit interconnection system

摘要: An electronic circuit interconnection system provides high density mounting of ceramic chip-carrier integrated devices or other beam-lead, dual-in-line (DIP), tape- automated-bonded (TAB), flip-chip, direct-mounted i.c. with wire-bonded interconnects the like on an economical, dimensionally-stable, substrate which has heat dissipating properties. The glass components are fused onto etched metal patterns and proportioned relative to so that heat-expansion properties correspond those maintain bond integrity between i.e. leads paths sufficient heat-dissipating permit mounting. substrates incorporate paths, device pads, edge terminals, pin holes typical features in multi- laminated plates selected thickness coated one both sides frit plates. Where more than layer desired, glass-coated stacked aligned coatings together. Metal vias extend through where desired interconnect layers substrate.