Method of fabricating multilayer printed circuit board structure

摘要: A composite printed circuit board structure including multiple layers of graphite interleaved with a dielectric material, such as polytetrafluoroethylene (PTFE) and woven glass laminate. Some the are copper clad, at least some positioned in close proximity to cladding layers, provide good heat dissipation properties. The PTFE provides desirably low constant also mechanical strength or negative coefficient thermal expansion, permit matching that chip carriers used mount components on board.