作者: Bharat M Mangrolia , Kalu K Vasoya , Don Roy
DOI:
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摘要: Printed wiring board assemblies are described that include printed boards having at least one thermally conductive plane. In addition, the can also edge plating on a portion of an board. The heat spreaders, sinks and/or paths to dissipate from assembly. many instances, spreaders microfoils. embodiment, invention includes circuit layer, dielectric plane and conducts