Method and structure for inhibiting dopant out-diffusion

作者: Madhukar B. Vora , Michael E. Thomas , Ashok K. Kapoor

DOI:

关键词:

摘要: A method for inhibiting out-diffusion of dopants from polycrystalline or single crystal silicon substrates high speed semiconductor devices into metal silicide conductive layers disposed on the substrate comprises interposing a refractory nitride layer between doped and layer. Dopant is further retarded, contact resistance lowered, by adding thin substrate.

参考文章(15)
W.J. Garceau, G.K. Herb, TiN as a diffusion barrier in the Ti-Pt-Au beam-lead metal system Thin Solid Films. ,vol. 53, pp. 193- 194 ,(1978) , 10.1016/0040-6090(78)90034-2
Marc Wittmer, TiN and TaN as diffusion barriers in metallizations to silicon semiconductor devices Applied Physics Letters. ,vol. 36, pp. 456- 458 ,(1980) , 10.1063/1.91505
M. Östling, C.S. Petersson, C. Chatfield, H. Norström, F. Runovc, R. Buchta, P. Wiklund, Arsenic distribution in bilayers of TiSi2 on polycrystalline silicon during heat treatment Thin Solid Films. ,vol. 110, pp. 281- 289 ,(1983) , 10.1016/0040-6090(83)90509-6
T. Shioyama, S. Ogawa, K. Takiguchi, T. Yotsuya, Pressure dependence of the electrical properties of TaN thin films Thin Solid Films. ,vol. 57, pp. 45- 48 ,(1979) , 10.1016/0040-6090(79)90397-3
Jun Amano, P. Merchant, Tim Koch, Arsenic out‐diffusion during TiSi2 formation Applied Physics Letters. ,vol. 44, pp. 744- 746 ,(1984) , 10.1063/1.94902
M‐A. Nicolet, M. Bartur, Diffusion barriers in layered contact structures Journal of Vacuum Science and Technology. ,vol. 19, pp. 786- 793 ,(1981) , 10.1116/1.571149
Marc Wittmer, High-temperature contact structures for silicon semiconductor devices Applied Physics Letters. ,vol. 37, pp. 540- 542 ,(1980) , 10.1063/1.91978
J.-S. Maa, Phosphorus out diffusion from double-layered tantalum silicide/polycrystalline silicon structure Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. ,vol. 1, pp. 1- 5 ,(1983) , 10.1116/1.582535