Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies
作者： Subhasis Mukherjee , Mohammed Nuhi , Abhijit Dasgupta , Mohammad Modarres
DOI: 10.1115/1.4033375
关键词:
摘要: … creep damage accumulation in solder joints during thermal … This variability can also be seen in the values of the viscoplastic creep … plastic properties were not available during the study. …
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cyberleninka.org 参考文章(116)
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