Manufacturing method of an adhesive sheet for laser dicing having a controlled average surface roughness (Ra)

摘要: It is an object of the invention to present adhesive sheet (4) for laser dicing capable workpiece into individual small pieces element securely at high production efficiency when forming a reformed region inside by light absorption ablation beam, and manufacturing method therefore. also using such dicing. The describes used chips in which has layer (2) least on one side base material (1), (1) surface not contacting with provided arithmetic average height (Ra) 0.4 mu m so that it free from convex parts width (W) 20 mm or less (h) 1 more, concave depth (d) more glued workpiece.