Wafer support having a dustproof covering film
作者： Tsutomu Yoneyama , Kazuhiko Tomaru , Ryuichi Handa
DOI:
关键词: Wafer 、 Materials science 、 Layer (electronics) 、 Composite material 、 Silicone rubber
摘要: A dustproof covering film-attached wafer support comprising a base, silicone rubber layer substantially uniform in thickness and integrated with the base film, film is attached to state that peel strength between from 5 500 g/25 mm, thereby enabling be peeled apart as need arises; production method for such support.
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