System for encapsulation of semiconductor chips

摘要: A system for encapsulating semiconductor chips, such as chips carrying chemical sensitive field-effect devices, includes lamination of a sheet dry film photoresist material onto the surface chip, placement photomask over chip in predetermined alignment, and then exposure to light so that passes through certain light-transmitting portions mask chip. The is developed remove from gate regions each devices define windows which are exposed. Chemical membrane systems may be applied cover regions.