Polished polyimide substrate
作者： V. S. Sudarshanam , John Farah
DOI:
关键词:
摘要: Polymer substrates, in particular polyimide and polymer laminates for optical applications are described. Polyimide substrates polished on one or both sides depending their thickness, single-layer multi-layer waveguide structures deposited the substrates. Optical devices machined by laser ablation using a combination of IR UV lasers. A waveguide-fiber coupler with laser-machined groove retaining fiber is also disclosed.
lens.org 参考文章(14)
Masakazu Mitsuhashi, Hitoshi Kurabe, Yasuaki Mashiko, Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof ,(2000)
R. Andrew McGill, Alberto Pique, Douglas B. Chrisey, Matrix assisted pulsed laser evaporation direct write ,(2000)
Tsutomu Yoneyama, Kazuhiko Tomaru, Ryuichi Handa, Wafer support having a dustproof covering film ,(2000)
John Farah, Venkatapuram S. Sudarshanam, Polished polymide substrate ,(1999)
Luis J. Matienzo, Allan R. Knoll, Kim J. Blackwell, Frank D. Egitto, Method of forming adherent metal components on a polyimide substrate ,(1997)
Anton Nenadic, Harbans Sachdev, Sundar M. Kamath, John P. Hummel, Charles H. Perry, Robert Neal Lang, Krishna G. Sachdev, Low tce polyimides as improved insulator in multilayer interconnected structures ,(1992)
Eugene A. Fitzergald, Silicon wafer with embedded optoelectronic material for monolithic oeic ,(2001)
Hidehisa Nanai, Yoshihiro Moroi, Yuji Yamamoto, Shigeki Sakaguchi, Process for producing polyimide platy object ,(2002)
Richard B. Tompane, Nigel J. Cockroft, David K. Wagner, Markus P. Hehlen, Simon J. Field, William K. Bischel, David A.G. Deacon, Optically integrating pixel microstructure ,(2000)
Theresa A. Sitnik-Nieters, Bernard Gorowitz, Herbert S. Cole, Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures ,(1993)