Chemical treatment apparatus and chemical treatment method
作者： Hayato Iwamoto , Kiyoshi Kurosawa
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摘要: A chemical treatment apparatus including a tank filled with which wafers are treated, and jet pipe having jetting holes is provided at the bottom portion of jets from thereof, containing least first for upwardly second in direction different that holes. The set to within range horizontal obliquely downward 45 degrees respect direction.
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