Method and device for etching substrates received in an etching solution

作者: Matthias Niese , Joerg Franzke , Juergen Osterkamp , Juergen Schweckendiek

DOI:

关键词: Dry etchingOptoelectronicsMaterials scienceAnalytical chemistrySubstrate (printing)Reactive-ion etchingIsotropic etchingEtching (microfabrication)

摘要: The invention relates to a method for etching substrates (4) received in an solution (2). Said comprises the following steps: A basin (1) which can receive (2) is prepared, substrate completely immersed (2), flow surrounds produced and speed and/or direction of be periodically altered.