作者: Matthias Niese , Joerg Franzke , Juergen Osterkamp , Juergen Schweckendiek
DOI:
关键词: Dry etching 、 Optoelectronics 、 Materials science 、 Analytical chemistry 、 Substrate (printing) 、 Reactive-ion etching 、 Isotropic etching 、 Etching (microfabrication)
摘要: The invention relates to a method for etching substrates (4) received in an solution (2). Said comprises the following steps: A basin (1) which can receive (2) is prepared, substrate completely immersed (2), flow surrounds produced and speed and/or direction of be periodically altered.