Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn3.0Ag0.5CuxTiO2 solder joints
作者： Y. Tang , S.M. Luo , K.Q. Wang , G.Y. Li
DOI: 10.1016/J.JALLCOM.2016.05.148
关键词:
摘要: … In this study, the effect of nano-TiO 2 particles additive on the … bond 0.5Cu single bond xTiO 2 solder and Cu substrate was … Nano-TiO 2 particles have a strong influence on the growth …
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