Effect of Ag 3 Sn nanoparticles and temperature on Cu 6 Sn 5 IMC growth in Sn-xAg/Cu solder joints
作者： Bingfeng Guo , Anil Kunwar , Ning Zhao , Jun Chen , Yunpeng Wang
DOI: 10.1016/J.MATERRESBULL.2017.11.022
关键词:
摘要: Abstract The growing importance of Pb-free Sn-xAg solders and high cost Ag has attracted the attention researchers to perform experiment with varied content element. In this study, Sn-xAg(0,1,2,3.5) solder balls on Cu substrate have been reflowed at 250/275/300 °C for 60 s air cooled. Finite element method utilized simulate concentration temperature during cooling. experimental results suggest that flux through grain boundary diffusion is dominant mechanism Cu6Sn5 intermetallic compound growth in Pure Sn Sn-1Ag solders. When increased, as case Sn-3Ag Sn-3.5Ag alloys; shielding effect Ag3Sn nanoparticles determinant factor affecting thickness IMC. Both influx rate are enhanced raise pre-cooled isothermal reflow temperature. observed thickest
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