Vertical FET devices including a contact on protruding portions of a substrate

作者: Park Yong Hee , Seo Kang Ill , Jung Young Chai , Kim Seon Bae , Kang Myung Gil

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摘要: VFET devices are provided. A device includes a substrate including first and second protruding portions. The an isolation region between the silicide regions on portions, respectively. Moreover, contact regions. Related methods of forming also

参考文章(12)
Takeshi Kajiyama, Semiconductor memory device with fin ,(2011)
Bruce B. Doris, Kangguo Cheng, Keith Kwong Hon Wong, Ying Zhang, Contacts for fet devices ,(2010)
Yung Fu Chong, Huilong Zhu, Hung Y. Ng, Nivo Rovedo, Kern Rim, Zhijiong Luo, Method of forming substantially L-shaped silicide contact for a semiconductor device ,(2006)
Borna Obradovic, Chris Bowen, Mark Rodder, Titash Rakshit, Palle Dharmendar, Vertical Field Effect Transistor with Biaxial Stressor Layer ,(2016)
Huiming Bu, Terence B. Hook, Junli Wang, Fee Li Lie, Brent A. Anderson, Bottom source/drain silicidation for vertical field-effect transistor (FET) ,(2015)
Huiming Bu, Terence B. Hook, Junli Wang, Fee Li Lie, Brent A. Anderson, Silicidation of bottom source/drain sheet using pinch-off sacrificial spacer process ,(2016)
Zhenxing Bi, Peng Xu, Juntao Li, Kangguo Cheng, ILD PROTECTION IN VFET DEVICES ,(2018)
Veeraraghavan S. Basker, Theodorus E. Standaert, Kangguo Cheng, Junli Wang, Semiconductor device including dual trench epitaxial dual-liner contacts ,(2016)