Rheological and thermal behaviour of DGEBA/EA and DGEHQ/EA epoxy systems crosslinked with TETA

作者: Fanica Mustata , Ioan Bicu

DOI: 10.1016/S0142-9418(00)00072-6

关键词:

摘要: Abstract Isothermal variation of the viscosity has been investigated in temperature range 20–60°C for diglycidyl ether bisphenol A/epoxy aniline/triethylenetetramine (DGEBA/EA/TETA) and hydroquinone/epoxy aniline triethylenetetramine (DGEHQ/EA/TETA) systems. The versus time determined using a ‘Rheotest 2.1’ viscometer equipped with cone plate geometry (36 mm diameter 0.3° angle) at shear rate 1 s−1. cure kinetics were studied DSC technique. thermal behaviour cured products was by thermogravimetric analysis MOM Budapest derivatograph. activation energies curing reaction calculated from gel have values between 18.78 kJ mol−1 DGEBA/EA/TETA 60.93 DGEHQ/EA/TETA system. present good stability, decomposition 96.46 93.70

参考文章(14)
Kris Neville, Henry Lee, Handbook of Epoxy Resins ,(1967)
Barbara Sandner, Hans-Jörg Ziegler, Claus Bischof, INTRODUCTION OF HYDROXYETHYL AND GLYCIDYL ESTER GROUPS INTO METHYL METHACRYLATE COPOLYMERS BY POLYMER ANALOGOUS REACTIONS Angewandte Makromolekulare Chemie. ,vol. 181, pp. 171- 182 ,(1990) , 10.1002/APMC.1990.051810114
Jatin R. Thakkar, Ravji D. Patel, Ranjan G. Patel, Vithal S. Patel, Glass fibre reinforced composites of triglycidyl‐p‐aminophenol British Polymer Journal. ,vol. 22, pp. 143- 146 ,(1990) , 10.1002/PI.4980220208
Jaroslav Jarušek, Josef Mleziva, Plastifizierung von epoxidharzen mit dimeren fettsäuren Angewandte Makromolekulare Chemie. ,vol. 111, pp. 213- 226 ,(1983) , 10.1002/APMC.1983.051110116
Fânicâ Mustatâ, Ioan Bicu, Plastified Epoxy Resins Modified by Hydrophilic and Hydrophobic Silica Polymer-plastics Technology and Engineering. ,vol. 37, pp. 127- 140 ,(1998) , 10.1080/03602559808006917
He Pingsheng, Li Chune, Study on cure behavior of epoxy resin–BF3–MEA system by dynamic torsional vibration method Journal of Applied Polymer Science. ,vol. 43, pp. 1011- 1016 ,(1991) , 10.1002/APP.1991.070430520
Chun-Shan Wang, J. R. Berman, L. L. Walker, A. Mendoza, Meta-bromobiphenol epoxy resins : applications in electronic packaging and printed circuit board Journal of Applied Polymer Science. ,vol. 43, pp. 1315- 1321 ,(1991) , 10.1002/APP.1991.070430713
D. Feldman, A. Blaga, E. Coriaty, Modification of epoxy polymer by plasticizing, blending, or reinforcing Journal of Applied Polymer Science. ,vol. 29, pp. 515- 531 ,(1984) , 10.1002/APP.1984.070290207
Fǎnicǎ Mustatǎ, Constantin N. Caşcaval, Ioan Bicu, Viscosimetric Investigation of Plasticized Epoxy Resin Polymer-plastics Technology and Engineering. ,vol. 34, pp. 461- 473 ,(1995) , 10.1080/03602559508012196