Electrical performance of high density probe array for testing Josephson circuit chips

摘要: An assembly has been constructed and successfully evaluated for contacting 228-pad Josephson test chips. Miniature spring contacts mate with the 228, 100 μm diameter pads arranged on 200 centers in a double row about edge of 6.35 mm chip. Measurements have made at 4.2K contact reliability, resistance, self mutual inductances, current capacity. Experimental values electrical characteristics compare well computer simulations. This probe array is being incorporated into non-magnetic cryoinsert chip testing. The design uses materials such as pyrex, molybdenum, silicon, machineable ceramic, aluminum to be consistent microgauss ambient magnetic field.