lens.org 参考文章(4)
Tatsuya Inaoka, Taizo Kise, Kohei Matsumoto, Yosuke Watanabe, Masaru Nakamura, Keiji Nomaru, Nobumori Ogoshi, Koichi Mitani, Wafer dividing method and wafer dividing apparatus ,(2007)
Hans-Ulrich Zuehlke, Patrick Mende, Gabriele Eberhardt, Method and device for dividing a plane-parallel plate made of a brittle material into a plurality of individual plates by means of a laser ,(2008)
Masaru Nakamura, 勝 中村, Method of fracturing bonding film attached on wafer ,(2005)
Noguchi Isamu, Ishiwatari Shinichi, Kamiyama Michio, Iwamoto Kazushige, RADIATION-CURABLE SELF-ADHESIVE TAPE ,(1991)