Wafer dividing method and wafer dividing apparatus
作者： Tatsuya Inaoka , Taizo Kise , Kohei Matsumoto , Yosuke Watanabe , Masaru Nakamura
DOI:
关键词: Adhesive 、 Materials science 、 Wafer 、 Division (mathematics) 、 Optics 、 Electronic engineering
摘要: A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lines and polymer film on front surface substrate is processed to allow for division comprising frame holding step putting an adhesive tape mounted annular frame; cooling that affixed diving by expanding cooled affixed.
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