Method for picking up device attached with adhesive tape
作者： Masaru Nakamura
DOI:
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摘要: A method for picking up a device stuck with an adhesive film includes tape expansion step expanding dicing to increase intervals between devices and films by pressing area inner diameter of the annular frame wafer means member held; picking-up from tape. relative shifting rate holding is set 100 mm/second or more when are brought into abutment against each other in step, increased μm more.
lens.org 参考文章(12)
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