Contact-bonded optically pumped semiconductor laser structure
作者： Dennis G. Fischer , Stuart Butterworth , Murray Reed
DOI:
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摘要: An optically pumped semiconductor (OPS) structure (15) includes a multilayer gain-structure (12) surmounting mirror (14). One surface of diamond heat spreader (18) is attached to the via contact bond. The opposite bonded metal sink (24). In one example, OPS-structure also has window (19) gain-structure.
lens.org 参考文章(24)
Daryl E. Weispfennig, Terry B. Solberg, Michael K. Hennies, Method for fabricating an electrical apparatus ,(1999)
Aram Mooradian, Mark E. Kuznetsov, High brightness, vertical cavity semiconductor lasers ,(1995)
Edward A. Aifer, Christopher L. Felix, John Glesener, Jerry R. Meyer, Igor Vurgaftman, William W. Bewley, Pressure-bonded heat-sink system ,(2000)
Peter Brick, Stephan Lutgen, Optically pumped laser device for generating laser pulses ,(2004)
John J. Zayhowski, Thermally controlled lenses for lasers ,(1994)
Helmuth E. Meissner, Composite optical and electro-optical devices ,(1995)
Delai Zhou, Luke J. Mawst, Vertical-cavity surface-emitting semiconductor laser arrays ,(2001)
Jun Zheng, Vcsel with heat-spreading layer ,(2001)
Eugene Dantsker, Stephen D. O'Connor, Christoph D. Karp, Microfluidic devices for methods development ,(2004)
John James Ritsko, Fuad Elias Doany, Paul Alfred Lauro, Maurice Heathcote Norcott, Jr. James Lupton Hedrick, George Frederick Walker, Leathen Shi, Brian Samuel Beaman, Keith Edward Fogel, Da-Yuan Shih, Three dimensional high performance interconnection package ,(1992)