Three dimensional high performance interconnection package

摘要: The present invention is directed to a structure (2) for packaging electronic devices, such as semiconductor chips (36, 38), in three dimensional which permits electrical signals propagate both horizontally and vertically. formed from plurality of assemblies (4, 6). Each assembly substrate (8) having disposed on at least one surface devices. stack adjacent assemblies. Between there an interconnection means (49) electrically interconnecting each assembly. elastomeric interposer. interposer material conductors extending therethrough, either clustered or un-clustered arrangement. fabricated apertures therethrough. array corresponds the devices substrates. aperture over so that between compressed thereby compressing thermally conductive diamond. A heat dissipation connected edges extract generated within structure. Methods fabricating stand alone sheet are described. ends (50, 54) upon compression 6) wiping action conductor (e.g. 50) contact locations 30) form good therewith.