作者: K. Kiziloglu , M.W. Yung , Hsiang-Chi Sun , S. Thomas , M.B. Kardos
DOI: 10.1109/ICIPRM.1998.712506
关键词:
摘要: We report the first successful demonstration of a pin diode/HEMT/HBT monolithic integrated optoelectronic receiver lattice-matched on InP substrates for multi-gigabit long wavelength applications. Our approach utilizes stacked single layer MBE growth HEMTs and HBTs after which HBT layers are patterned selectively wet etched to expose HEMT layers. The subsequent process steps feature with 0.12 /spl mu/m T-gates, 2 emitter fingers, TaN thin-film resistors, SiN MIM capacitors, photodetector antireflection coatings. photodiodes comprise base-collector junctions thus fabricated at same time as HBTs. circuit high-gain three stage amplifier within transimpedance feedback loop front end. high f/sub T/ fully fabrication together photodiode result in very small input node capacitance low noise. A flat gain -6 k/spl Omega/ bandwidth 2.5 GHz is observed supply voltages between 2.8-3.0 V. Circuit operation up 7 Gb/s obtained an PRBS length 2/sup 7/-1. At 10/sup -9/ BER, sensitivities -24.7, -21.2 -18.5 dBm 2.5, 4 respectively. Gb/s, good photocurrent sensitivity (/spl eta/P) -27.9 measured.