Adhesive on wire stacked semiconductor package

作者： Byoung Youl Min , Kwang Seok Oh , Young Kuk Park , Jong Wook Park

DOI:

关键词:

摘要: A semiconductor package and a method of producing the same has substrate. first chip is coupled to surface The second surfaces which are substantially flat in nature. An adhesive layer chip. having nature further provided. insulator for preventing shorting wirebonds. by thereof.

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