Flame retardant structure for component carrier
作者： Silvano De Sousa Jonathan , Leitgeb Markus
DOI:
关键词:
摘要: A method of manufacturing a constituent for component carrier is disclosed. The includes providing an electrically conductive structure, forming highly thermally and insulating or semiconductive structure on the subsequently, attaching having lower thermal conductivity than exposed surface structure.
lens.org 参考文章(25)
Ulrich Koeger, Hanspeter Katz, Christian Rapp, Eric Wolf, Jochen Artmann, Circuit board with ceramic inlays ,(2014)
Lee King-Lien, CIRCUIT BOARD WITH HEAT SINK AND METHOD OF FABRICATING THE SAME ,(2012)
Toshikazu Endo, Minoru Takaya, Kenichi Kawabata, Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards ,(2003)
Sun Woo Yun, Kwang Soo Kim, Sung Keun Park, Young Ki Lee, Jin Suk Son, Power module package and method for manufacturing the same ,(2011)
Takatosi Abe, 博晴 井上, 孝寿 阿部, Hiroharu Inoue, 岸野 光寿, Koji Kishino, High-heat-resistant epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board ,(2010)
Norbert Galster, Alex Bruderer, Michel Probst, Juergen Kress, Composite build-up material for embedding of circuitry ,(2011)
Jens Florian Hockel, Patrick Müller, Printed circuit board and process for manufacturing such a printed circuit board ,(2005)
Qing Xin Zhang, Li Hui Guo, Device Carrying an Intergrated Circuit/Components and Method of Producing the Same ,(2005)
Amarjit Singh Rai, Alfred Viehbeck, Jeffrey Curtis Hedrick, Kostas Papathomas, Stephen Leo Tisdale, High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer ,(1997)