Device Carrying an Intergrated Circuit/Components and Method of Producing the Same
作者： Qing Xin Zhang , Li Hui Guo
DOI:
关键词:
摘要: A method of forming an integrated circuit component on insulating substrate (21), comprising providing a first layer arrangement and second arrangement, each supply dielectric (17), the at least one arrangements therein; attaching surface with facing substrate, opposing wherein are so arranged to sandwich portion between arrangements.
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